It is suitable for acidic copper plating processes of high-end circuit boards (such as HDI, FPC, and IC substrates) with insoluble anodes, meeting the requirements of high-end manufacturing processes.
Core Specification
Assay ≥ 99%, Chloride Ion ≤ 30 ppm
Applications
It is suitable for acidic copper plating processes of high-end circuit boards (such as HDI, FPC, and IC substrates) with insoluble anodes, meeting the requirements of high-end manufacturing processes.
