It is tailor-made for cutting-edge fields with extremely high impurity sensitivity such as semiconductor chip manufacturing, high-end electronic electroplating, and precision analytical testing.

It is tailor-made for cutting-edge fields with extremely high impurity sensitivity, such as semiconductor chip manufacturing, high-end electronic electroplating, and precision analytical testing. It defines industry standards with ultimate purity and helps customers overcome the critical raw material challenges in high-end manufacturing.

Semiconductor industry, photovoltaic cells, high-end optical materials, analytical reference standards

Logic Chips with Advanced Nodes of 2–14 nm and Below, Interconnect Structures for 3D NAND Memory Chips, and Metal Interconnects for Wafer-Level Packaging (WLP)

Chip Lead Nickel Plating, WLP Metal Interconnects, Semiconductor Equipment Coatings

It is suitable for acidic copper plating processes of high-end circuit boards (such as HDI, FPC, and IC substrates) with insoluble anodes, meeting the requirements of high-end manufacturing processes.

As a core raw material for acidic copper plating processes, it provides a stable source of Cu²⁺ ions for the plating bath. It is widely used in plastic electroplating, electroforming, surface finishing, PCB (Printed Circuit Board) manufacturing, electronic component production, electroless copper plating processes, as well as interconnection technologies and packaging processes in the microelectronics field.