6N UHP Cobalt Sulfate (Solid) - Shenzhen Ninglian Technology Co., Ltd.

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Ultrapure Semiconductor Materials

6N UHP Cobalt Sulfate (Solid)

Logic Chips with Advanced Nodes of 2–14 nm and Below, Interconnect Structures for 3D NAND Memory Chips, and Metal Interconnects for Wafer-Level Packaging (WLP)

Core Specifications

Purity ≥ 99.9999% (6N), Total Metallic Impurities (TMI) ≤ 1 ppm, Key Metallic Impurities ≤ 10 ppb

Applications

Logic Chips (2–14 nm & Below Advanced Nodes), 3D NAND Interconnect Structures (BEOL), WLP Metal Interconnects (Microbumps/RDL)